The number of transistors inside a chip gives you an idea of how powerful and/or energy-efficient said chip is. An example I like to use involves Apple's A-series application processor used to power the iPhone. The A13 Bionic AP that powered the iPhone 11 series was built by TSMC using its 7nm process node and came loaded with 8.5 billion transistors.
According to @faridofanani96, the Dimensity 9400 AP will measure 150mm² making it the largest chipset earmarked for a smartphone when it is introduced later this year. This will allow the SoC to carry a large number of transistors along with a bigger Neural Processing Unit for AI and Machine Learning. Cache sizes will also be larger and the Dimensity 9400 AP could be equipped with more than 30 billion transistors.
TSMC will be manufacturing the Dimensity 9400 AP using its second-generation 3nm node and all things considered, this will probably be the most expensive smartphone chipset ever designed by MediaTek., there has been some talk about the Cortex-X5 Prime CPU core having some temperature issues. One theory is that MediaTek increased the size of the chip's die as a way to deal with this issue.
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