Space Race Heats Up: Tackling Thermal Challenges Beyond Earth

New research examines advanced thermal management technologies essential for the reliability and performance of spacecraft electronics, discussing materials, structures, and systems that mitigate heat challenges in space missions. Schematic of the thermal environment for electronics in spacecraft. Credit: Yi-Gao Lv, et al.

A new review examines advancements in thermal management technologies for spacecraft electronics, tackling the problems of heat acquisition, transport, and rejection in the extreme conditions of space. This review is intended to inform the development of future thermal management systems for spacecraft, enhancing both the reliability and effectiveness of space missions.

The review evaluates thermal management technologies for spacecraft electronics, focusing on heat acquisition, transport, and rejection. It explores high thermal conductance materials like carbon-based composites and annealed pyrolytic graphite and discusses novel packaging structures using micro-/nano-electromechanical system technologies.

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