Researchers developed a modular fabrication process to produce a quantum-system-on-chip that integrates an array of artificial atom qubits onto a semiconductor chip. Credit: Sampson Wilcox and Linsen Li, RLE, editedand MITRE have developed a scalable, modular quantum hardware platform, incorporating thousands of qubits on a single chip, promising enhanced control and scalability.
“We will need a large number of qubits, and great control over them, to really leverage the power of a quantum system and make it useful. We are proposing a brand new architecture and a fabrication technology that can support the scalability requirements of a hardware system for a quantum computer,” says Linsen Li, an electrical engineering and computer science graduate student and lead author of a paper on this architecture.
In addition, diamond color centers have photonic interfaces which allows them to be remotely entangled, or connected, with other qubits that aren’t adjacent to them. “This compensates for the in-homogenous nature of the system. With the CMOS platform, we can quickly and dynamically tune all the qubit frequencies,” Li explains.To build this QSoC, the researchers developed a fabrication process to transfer diamond color center “microchiplets” onto a CMOS backplane at a large scale.
They built an in-house transfer setup in the lab and applied a lock-and-release process to integrate the two layers by locking the diamond microchiplets into the sockets on the CMOS chip. Since the diamond microchiplets are weakly bonded to the diamond surface, when they release the bulk diamond horizontally, the microchiplets stay in the sockets.
“We have iterated and developed the recipe to fabricate these diamond nanostructures in MIT cleanroom, but it is a very complicated process. It took 19 steps of nanofabrication to get the diamond quantum microchiplets, and the steps were not straightforward,” he adds.
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